Soldering and Joining
Our engineers examine the soldering, joining, and manufacturing process of electronic components in order to determine if these factors may be the cause of failure--or an opportunity for improvement. With the support of a metallurgical lab and extensive electronic test and measurement equipment, we can thoroughly examine the integrity of the soldering and joining of printed circuit boards and electronic components. Projects often involve:
- Component and printed circuit board failure analysis
- Printed circuit board analysis
- Semiconductor materials and products assessment
- Analysis of electronics manufacturing processes
Latest News
Green Fuels Depot A Packer Engineering Project
The City of Naperville, Argonne National Laboratory, the College of DuPage, Packer Engineering, Inc., and the Center for Application Based Learning (CABL) are working together to accomplish the construction and operation of the Green Fuels Depot demonstration program....
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Please call 800.323.0114 or fill out the Pre-Project Request Form